ULTRAVIOLET LASER MARKING MACHINE
| Laser Wavelength | 355nm 266nm | Beam Quality | <2 |
| Laser Repetition | 8Khz-15Khz | Standard Marking Area | 110mm x 110mm |
| Making Depth | ≤0.5mm(Can be Adjustable) | Marking Speed | ≤7000mm/s |
| Min. Line Width | 0.01mm | Min. Character Size | 0.05mm |
| Repetition Precision | ±0.001mm | Power Consumption | ≤500W |
| Cooling method | Air cooled | Power Supply | 220V/50Hz/10A |
| Lens Type | HBS-65 | HBS-110 | HBS-175 |
| Focal Length | 100mm | 170mm | 250mm |
| Marking Area | 65mm*65mm | 110mm*110mm | 175mm*175mm |
| Note: Without special request, HBS will fix our standard lens with Model: HBS-110 | |||
Ultraviolet Laser Marking Machine is self-developed by HBS and has the world's most advanced technology. It has following features: high electro-optical conversion rate, long working time of nonlinear crystal, high stability, high positioning accuracy, high operation efficiency, optimized modular design for convenient installation and maintenance. Equipped with two-dimensional automated workstation, it can realize marking continuously in multi-stage or large-size marking. The laser marking line is very fine that suitable for marking with high demand, it's mainly applied to mark the products such as LCD screen, IC wafer and IC chips.
Applicable Materials & Industry
Mainly used in the marking and surface processing of materials such as of all sorts of glass, TFT, LCD screen, Plasma screen, textile products, ceramic chip, mono-crystal silicon wafer, IC chip, sapphire and thin polymer film. The main advantage of Ultraviolet laser is in the complementing of the shortcoming of other bandwidth lasers in precision machining and processing of special materials.
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