Technical parameters:
1.Product structure :
1.Using the German semiconductor laser pumping, three times optical resonant cavity frequency doubling output 355nm wavelength laser, electro-optical conversion efficiency, high beam quality is TEM 100 mode.
2.UV laser is a cold light source, heat-affected zone is small, excellent beam quality to create ultra fine marking results.
3.Imported scanning, marking fast, suitable for both micro-cutting and drilling.
4.High and ultra-high peak power characteristics with minimal thermal effect, very suitable for alumina, zirconia ceramic drill cutting.
5.Lasers 20,000 hours maintenance free, no supplies, use of low cost, energy saving.
6.The software can receive DXF,PLT,BMF,AI,JPG and other formats, and can automatically generate serial number and production date, barcode, two-dimensional code.
2.Applicable Industry:
Metal and nonmetal materials, such as ceramic, sapphire, glass, transparent polymeric materials, plastics, etc.
3.Applicable Materials
Consumer electronics, mobile phone parts, LCD screen, two-dimensional code and trademarks sculpture, ceramics, sapphire piece, FPC flexible circuit board micro-drilling. Cutting biomedical glass engraved lines, capactive touch screen ITO etching.
| Model No. | UV-5W |
| Laser Type | ND: YVO |
| Wavelength | 355nm |
| Laser source | Diode 808nm pump laser source |
| Maximum Laser Power | 3W/ 5W |
| Laser beam | 1.1 |
| Minimum character | 0.1mm |
| Minimum line width | 0.01mm |
| Speed | 400 characters / second |
| Repeat precision | ±0.001mm |
| Working area | 110mm*110mm / 180mm*180mm |
| Dimension | 900mm*680mm*1200mm |
| Gross Weight | 120kg |
| Power | 220V / 50Hz / 10A |
| Gross Power | 1.2 KW |
1.Product structure :
1.Using the German semiconductor laser pumping, three times optical resonant cavity frequency doubling output 355nm wavelength laser, electro-optical conversion efficiency, high beam quality is TEM 100 mode.
2.UV laser is a cold light source, heat-affected zone is small, excellent beam quality to create ultra fine marking results.
3.Imported scanning, marking fast, suitable for both micro-cutting and drilling.
4.High and ultra-high peak power characteristics with minimal thermal effect, very suitable for alumina, zirconia ceramic drill cutting.
5.Lasers 20,000 hours maintenance free, no supplies, use of low cost, energy saving.
6.The software can receive DXF,PLT,BMF,AI,JPG and other formats, and can automatically generate serial number and production date, barcode, two-dimensional code.
2.Applicable Industry:
Metal and nonmetal materials, such as ceramic, sapphire, glass, transparent polymeric materials, plastics, etc.
3.Applicable Materials
Consumer electronics, mobile phone parts, LCD screen, two-dimensional code and trademarks sculpture, ceramics, sapphire piece, FPC flexible circuit board micro-drilling. Cutting biomedical glass engraved lines, capactive touch screen ITO etching.